Popular 3D models
No results
About
Deepmaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer and temperature-resistant underfill coating material supppliers
Category
Individual / Other
Website
https://www.epoxyadhesiveglue.com/bga-package-underfill-epoxy/
Member since
January 10th 2023
Stats
0 views
0 likes
0 triangles
0 vertices