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DeepMaterial Chip Underfill Adhesive series are one component, heat curable materials. The materials have been optimized for capillary underfill and reworkability. These epoxy based materials can be dispensed on the edges of the BGA, CSP or Flip Chip devic
Category
Individual / Other
Website
https://www.epoxyadhesiveglue.com/case-in-usa-american-partners-chip-underfill-solution/
Member since
September 20th 2022
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