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DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve th
Category
Individual / Designer
Website
https://www.deepmaterialcn.com/epoxy-based-chip-underfill.html
Member since
June 28th 2022
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