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DeepMaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer,supply industrial applian
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DeepMaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer,supply industrial appliance structural bonding epoxy adhesive glue,low refractive index epoxy resin adhesive glue,high refractive index optic
Category
Individual / Game Developer
Website
https://www.uvadhesiveglue.com/applications
Member since
August 25th 2023
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